ʻO ka lāʻau lapaʻau PCB ke kī a me ke kumu o ka maikaʻi patch SMT.ʻO ke kaʻina hana lapaʻau o kēia loulou ka mea nui i kēia mau mea.I kēia lā, e kaʻana aku au iā ʻoe i ka ʻike ma ka papa kaapuni ʻoihana hōʻoia:
(1) Ma waho aʻe o ENG, ʻaʻole ʻike maopopo ʻia ka mānoanoa o ka papa plating i nā kūlana ʻāina kūpono o PC.Pono e hoʻokō i nā koi solderability.ʻO nā koi nui o ka ʻoihana penei.
OSP: 0.15 ~ 0.5 μm, ʻaʻole i kuhikuhi ʻia e IPC.Manaʻo ʻia e hoʻohana i ka 0.3 ~ 0.4um
EING: Ni-3～5um;Au-0.05～0.20um (ʻo ka PC wale nō ke kuhikuhi i ke koi ʻoi loa o kēia manawa)
Im-Ag: 0.05 ~ 0.20um, ʻoi aku ka mānoanoa, ʻoi aku ka paʻakikī o ka corrosion (PC ʻaʻole i kuhikuhi ʻia)
Im-Sn: ≥0.08um.ʻO ke kumu o ka mānoanoa, ʻo ia ka Sn a me Cu e hoʻomau i ka ulu ʻana i CuSn ma ka lumi wela, e pili ana i ka solderability.
Hoʻokumu maoli ʻia ʻo HASL Sn63Pb37 ma waena o 1 a me 25um.He paʻakikī ke hoʻomalu pono i ke kaʻina hana.Hoʻohana nui ke alakaʻi ʻole i ka alloy SnCu.Ma muli o ke kiʻekiʻe o ka hana wela, ua maʻalahi ka hana ʻana iā Cu3Sn me ka maikaʻi ʻole o ke kani ʻana, a ʻaʻole hoʻohana ʻia i kēia manawa.
(2) ʻO ka hiki ke hiki i ka SAC387 (e like me ka manawa pulu ma lalo o nā manawa hoʻomehana like ʻole, ʻāpana: s).
0 manawa: im-sn (2) florida aging (1.2), osp (1.2) im-ag (3).
ʻO Zweiter PLENAR SESSION ʻO Zweiter PLENAR SESSION Loaʻa iā Im-Sn ke kūpaʻa ʻino maikaʻi loa, akā ʻoi aku ka maikaʻi o kona kūpaʻa solder!
4 manawa: ENG (3)-ImAg (4.3)-OSP (10)-ImSn (10).
(3) ʻO ka pulu i ka SAC305 (ma hope o ka hele ʻana i ka umu ʻelua).
ENG (5.1)—Im-Ag (4.5)—Im-Sn (1.5)—OSP (0.3).
I ka ʻoiaʻiʻo, pilihua paha nā amateurs me kēia mau ʻoihana ʻoihana, akā pono e hoʻomaopopo ʻia e nā mea hana o ka PCB proofing a me ka patching.
Ka manawa hoʻouna: Mei-28-2021
