Nā kikoʻī | |
ʻAno | Waiwai |
Mea hana: | Winbond |
Māhele Huahana: | NOR Flash |
RoHS: | Nā kikoʻī |
Kāila kau ʻana: | SMD/SMT |
Pūʻolo / hihia: | SOIC-8 |
moʻo: | W25Q64JV |
Nui memo: | 64 Mbit |
Voltage Hoʻolako - Min: | 2.7 V |
Voltage Hoʻolako - Max: | 3.6 V |
Heluhelu ʻeleu i kēia manawa - Max: | 25 mA |
ʻAno Interface: | SPI |
Ka nui o ka uaki: | 133 MHz |
Hui: | 8 M x 8 |
ʻIkepili kaʻaahi laula: | 8 bit |
ʻAno manawa: | Kaulike |
Mahana hana liʻiliʻi loa: | - 40 C |
ʻO ka wela hoʻohana kiʻekiʻe loa: | + 85 C |
Packaging: | pā |
Brand: | Winbond |
Hāʻawi i kēia manawa - Max: | 25 mA |
ʻAi ʻoluʻolu: | ʻAe |
ʻAno Huahana: | NOR Flash |
Ka nui o ka waihona hale hana: | 630 |
Māhele ʻāpana: | Hoʻomanaʻo a me ka waihona ʻikepili |
inoa kalepa: | SpiFlash |
Huina Weight: | 0.006349 oz |
Nā hiʻohiʻona:
* ʻOhana Hou o SpiFlash Memories – W25Q64JV: 64M-bit / 8M-byte
– SPI maʻamau: CLK, /CS, DI, DO
– ʻElua SPI: CLK, /CS, IO0, IO1
– Quad SPI: CLK, /CS, IO0, IO1, IO2, IO3 – Hoʻoponopono hou i nā lako polokalamu a me nā lako (1)
* Kiʻekiʻe Hana Serial Flash
- 133MHz Hoʻokahi, Dual/Quad SPI uaki
266/532MHz like Dual/Quad SPI
– Min.100K Program-Erase cycles ma kēlā me kēia māhele - ʻOi aku ma mua o 20-makahiki mālama ʻikepili
* Heluhelu "hoʻomau" maikaʻi
- Heluhelu mau me 8/16/32/64-Byte Wrap - E like me 8 mau hola e hoʻoponopono ai i ka hoʻomanaʻo.
- Hāʻawi i ka hana XIP maoli (hoʻokō ma kahi) - ʻoi aku ka maikaʻi o ka X16 Parallel Flash
* Ka mana haʻahaʻa, ka laulā wela ākea - hoʻokahi 2.7 a 3.6V lako
- <1μA Ka mana iho (ʻano.)
– -40°C a i +85°C pae hana
* Hoʻolālā ʻoluʻolu me nā ʻāpana 4KB
– ʻĀpana Kaulike/Paka Holoi (4K/32K/64K-Byte) – Papahana 1 a 256 byte no kēlā me kēia ʻaoʻao programmable
* Nā hiʻohiʻona palekana
– Palekana a me ka lako lako kamepiula
– Palekana OTP kūikawā(1)
- ʻO luna / lalo, Hoʻohui i ka pale ʻana - Palekana pākahi / ʻāpana ʻāpana pale
- 64-Bit Unique ID no kēlā me kēia hāmeʻa
- Kakau inoa o nā ʻāpana ʻike ʻia (SFDP) - 3X256-Bytes Nā papa inoa palekana
– Volatile & Non-volatile kūlana kakau Bits
* Hoʻopaʻa ʻana i ka lewa
– 8-pin SOIC 208-mil / VSOP 208-mil
– 8-papa WSON 6x5-mm/8x6-mm, XSON 4x4-mm – 16-pin SOIC 300-mil
– 8-pin PDIP 300-mil
– 24-popo TFBGA 8x6-mm (6x4 poepoe hui)
– 24-pōpopo TFBGA 8x6-mm (6x4/5x5 hui kinipopo)
- E kelepona iā Winbond no KGD a me nā koho ʻē aʻe